Qualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash Palkhiwala

Qualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash PalkhiwalaQualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash PalkhiwalaQualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash PalkhiwalaQualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash PalkhiwalaQualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash PalkhiwalaQualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash PalkhiwalaQualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash PalkhiwalaQualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash PalkhiwalaQualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash PalkhiwalaQualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash PalkhiwalaQualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash PalkhiwalaQualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash PalkhiwalaQualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash PalkhiwalaQualcomm in talks to start chip packaging in India, open to new fab players, says global COO Akash Palkhiwala